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RESISTOR-CONDUCTOR LAMINATES: A CERAMIC SUBSTRATE ALTERNATIVE.AL ERTEL.1973; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1973; VOL. 13; NO 10; PP. 159-161Article

COUCHES MINCES FERROELECTRIQUES SUR SUBSTRATS SEMICONDUCTEURSSUGIBUCHI K.1975; OYO BUTURI; JAP.; DA. 1975; VOL. 44; NO 7; PP. 812-815; BIBL. 18 REF.Article

THICK FILM ELECTRONIC CIRCUITS.THORN JH.1973; IN: SOC. MANUF. ENG. CREATIVE MANUF. ENG. PROGRAMS. TECH. PAP.; DEARBORN, MICH.; 1973; DEARBORN, MICH.; SME; DA. 1973; VOL. 187; PP. 1-7Conference Paper

TRANSVERSE COUPLING IN FIBER OPTICS. II. COUPLING TO MODE SINKS.ARNAUD JA.1974; BELL SYST. TECH. J.; U.S.A.; DA. 1974; VOL. 53; NO 4; PP. 675-696; BIBL. 8 REF.Article

TINY THIN-FILM CHIP RESISTORS.1974; MICROWAVE J.; U.S.A.; DA. 1974; VOL. 17; NO 6; PP. 34Article

REALISATION DE RESISTANCES DE FORTES VALEURS PAR IMPLANTATION D'IONS METALLIQUES DANS LA SILICE THERMIQUE.ESTEVE D; BUXO J; SARRABAYROUSE G et al.1974; VIDE; FR.; DA. 1974; NO 171 SUPPL.; PP. 302-311; BIBL. 5 REF.; (APPL. PROCESSUS ELECTRON. IONIQUES. IVEME CONGR. INT. AVISEM 74; TOULOUSE; 1974)Conference Paper

RELAXATION METHOD COMPUTATION OF COPLANAR-TYPE STRIP LINES CHARACTERISTICSHATSUDA T.1972; REV. ELECTR. COMMUNIC. LAB.; JAP.; DA. 1972; VOL. 20; NO 9-10; PP. 825-836; BIBL. 14 REF.Serial Issue

UEBER DIE HAFTFESTIGKEIT VON METALLSCHICHTEN AUF STREIFENLEITUNGS-SUBSTRATEN. = L'ADHERENCE DES COUCHES METALLIQUES SUR DES SUBSTRATS EN BANDESWESTPHAL K.1976; NACHR.-TECH., ELEKTRON.; DTSCH.; DA. 1976; VOL. 26; NO 2; PP. 70-73; ABS. RUSSE ANGL. FR.; BIBL. 21 REF.Article

TECNOLOGIO DEI CIRCUITI INTEGRATI A MULTISTRATO CERAMICO MONOLITICO. = TECHNOLOGIE DES CIRCUITS INTEGRES MONOLITHIQUE A CERAMIQUE MULTICOUCHESGHERGIA V.1974; ELETTRON. E TELECOMUNIC.; ITAL.; DA. 1974; VOL. 23; NO 5; PP. 163-171; ABS. ANGL.; BIBL. 5 REF.Article

DISPERSION IN MICROSTRIP LINES COMPRISING LAYERED DIELECTRIC MEDIAWAHI PK; TURSKI Z.1981; ELECTRON. LETT.; ISSN 0013-5194; GBR; DA. 1981; VOL. 17; NO 21; PP. 785-786; BIBL. 5 REF.Article

EINE METHODE ZUR SCHNELLEN PRUEFUNG UND ZUR GENAUEN MESSUNG DIELEKTRIZITAETSZAHL VON KERAMIKSUBSTRATEN. = METHODE DE CONTROLE RAPIDE ET DE MESURE PRECOCE DE LA CONSTANTE DIELECTRIQUE DES SUBSTRATS DE CERAMIQUEDEUTSCH J; SCHLAGHECK E.1976; NACHR.-TECH. Z.; DTSCH.; DA. 1976; VOL. 29; NO 2; PP. 148-149; ABS. ANGL.; BIBL. 4 REF.Article

A NEW GENERATION OF THICK-FILM GOLD CONDUCTOR PASTES. IMPROVED PROPERTIES OF GLASS-FREE PREPARATIONS.1975; GOLD BULL.; S. AFR.; DA. 1975; VOL. 8; NO 1; PP. 13-15; BIBL. 7 REF.Article

COMPATIBLE THIN FILM CAPACITORS.BUTTOO RS; MURTHY BS.1974; INDIAN J. TECHNOL.; INDIA; DA. 1974; VOL. 12; NO 1; PP. 13-15; BIBL. 3 REF.Article

GROWTH MORPHOLOGY AND SURFACE-ACOUSTIC-WAVE MEASUREMENTS OF ALN FILMS ON SAPPHIRE. = MORPHOLOGIE DE LA CROISSANCE ET MESURES D'ONDES ACOUSTIQUES DE SURFACE POUR DES COUCHES MINCES DE ALN SUR DU SAPHIRLIU JK; LAKIN KM; WANG KL et al.1975; J. APPL. PHYS.; U.S.A.; DA. 1975; VOL. 46; NO 9; PP. 3703-3704; BIBL. 18 REF.Article

DETERMINATION OF IMPURITY AND MOBILITY DISTRIBUTIONS IN EPITAXIAL SEMICONDUCTING FILMS ON INSULATING SUBSTRATE BY C-V AND Q-V ANALYSIS.LEHOVEC K.1974; APPL. PHYS. LETTERS; U.S.A.; DA. 1974; VOL. 25; NO 5; PP. 279-281; BIBL. 10 REF.Article

AN EVAPORATION SYSTEM FOR THE METALLIZATION OF BILEVEL SUBSTRATES.DAVIS RH; DEO SR.1974; J. VACUUM SCI. TECHNOL.; U.S.A.; DA. 1974; VOL. 11; NO 1; PP. 77-80; BIBL. 5 REF.; (20TH NATL. SYMP. AM. VAC. SOC. 11TH CONF. MICROBALANCE TECH. PROC.; NEW YORK; 1973)Conference Paper

LASER SCRIBING AND DRILLING OF CERAMIC SUBSTRATES.BELLAND R.1975; ELECTRON. PACKAG. PRODUCT.; U.S.A.; DA. 1975; VOL. 15; NO 1; PP. 56-58Article

SCATTERING BY AN INFINITE PERIODIC ARRAY OF THIN CONDUCTORS ON A DIELECTRIC SHEET.MONTGOMERY JP.1975; I.E.E.E. TRANS. ANTENNAS PROPAG.; U.S.A.; DA. 1975; VOL. 23; NO 1; PP. 70-75; BIBL. 5 REF.Article

CARACTERISTIQUES DE DISPERSION DE LIGNES A MICROBANDES SUR SUPPORT ANISOTROPELERER AM; MIKHALEVSKIJ VS.1983; RADIOTEHNIKA I ELEKTRONIKA; ISSN 508322; SUN; DA. 1983; VOL. 28; NO 1; PP. 36-43; BIBL. 12 REF.Article

SPREAD IN EFFECTIVE PERMITTIVITY OF ALUMINA SUBSTRATESACCATINO L; ANGELUCCI A.1979; ELECTRON. LETTERS; GBR; DA. 1979; VOL. 15; NO 2; PP. 64-65; BIBL. 5 REF.Article

VERRE UTILISE COMME SUBSTRAT EN ELECTRONIQUECERCHEZ M; DUMITRU M; NEGREANU T et al.1976; INDUSTR. USOARA, PIEL.; ROMAN.; DA. 1976; VOL. 23; NO 2; PP. 82-85; ABS. RUSSE ALLEM. FR. ANGL.; BIBL. 17 REF.Article

NORMALLY-OFF M.E.S.F.E.T. WITH FAST SWITCHING BEHAVIOUR.KOHN E.1974; ELECTRON. LETTERS; G.B.; DA. 1974; VOL. 10; NO 24; PP. 505; BIBL. 4 REF.Article

LASER TRIMMING OF THICK FILM RESISTORS ON MULTILAYER DIELECTRICHAIN JA.1980; ELECTRON. PACKAG. PRODUCT.; USA; DA. 1980; VOL. 20; NO 6; PP. 145-153; 7 P.; BIBL. 2 REF.Article

ELECTROMIGRATION OF TI-AU THIN-FILM CONDUCTORS AT 180OC.ENGLISH AT; TAI KL; TURNER PA et al.1974; J. APPL. PHYS.; U.S.A.; DA. 1974; VOL. 45; NO 9; PP. 3757-3767; BIBL. 33 REF.Article

FULL WAFER SIZE LSI MOUNTINGNISHI I; MORIYA K; OSAKI T et al.1979; REV. ELECTR. COMMUNIC. LAB.; JPN; DA. 1979; VOL. 27; NO 1-2; PP. 92-96; BIBL. 4 REF.Article

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